NUMERICAL INVESTIGATION OF TEMPERATURE VARIATIONS ON THE IMPEDANCE SIGNATURE OF PIEZOELECTRIC SENSORS USED IN ELECTROMECHANICAL IMPEDANCE-BASED STRUCTURAL HEALTH MONITORING
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Date
2020
Journal Title
Journal ISSN
Volume Title
Publisher
ÉCOLE SUPERIEURE DE TECHNOLOGIES INDUSTRIELLES - ANNABA -
Abstract
The field of structural health monitoring has seen a fundamental shift in recent years, as researchers strive to replace conventional non-destructive evaluation techniques with smart material based techniques. Perhaps the most promising of smart material tech niques for developing structural health monitoring (SHM) systems is electromechanical impedance (EMI), which can be used for real-time structural damage assessment and is considered to be a new non-destructive evaluation method. It is gaining popularity due to its potential of providing structure safety and reliability while still reducing maintenance costs. This work presents numerical study conducted to investigate the effects of different cases of damage with temperature on the electrical impedance of the piezoelectric sensor used in the EMI technique. The finite element method was used ANSYS software where the three dimensional (3D) to simulate an aluminum beam at varying temperatures. Real-time monitoring of the structure is achieved based on harmonic measurements. The results conclusively show that the proposed EMI system offers excellent damages detection sensitivity that remains suitable for real-time monitoring across a range of temperature conditions